IP Library Granted Patent US 8,002,542
Granted Patent B2
US 8,002,542 · App. 11/822,337 · Granted Aug 23, 2011

Heat treatment jig and heat treatment jig set

Assignee: Renesas Electronics Corporation
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Quick Facts
Patent No.
US 8,002,542
App. No.
11/822,337
Granted
Aug 23, 2011
Kind
B2
Abstract

A heat treatment jig includes a holding concave portion to hold an object and a void part formed near the holding concave portion and a thermal history variation of the object in a heat treatment process is reduced thereby.

Claims (38)

1. A heat treatment jig, comprising:

a substrate having a main surface including a holding concave portion formed in said main surface, said holding concave portion having sides and a bottom, said bottom being configured to hold an object;

a void part formed in said main surface adjacent to and outside an inner wall of the holding concave portion, the void part being a through-hole and the void part being formed near each of surfaces constituting a sidewall of the holding concave portion;

a plurality of the holding concaved portions in array; and

a common void part formed near sidewalls of the holding concave portions and shared by the plurality of adjacent holding concave portions.

2. The heat treatment jig according to claim 1 , further comprising:

a plurality of the holding concave portions in array; and

a common void part formed near sidewalls of the holding concave portions and shared by the plurality of adjacent holding concave portions as the void part,

wherein the void part is formed to be a slit-like shape in a position almost parallel to the sidewall of the holding concave portion, and

wherein the void part is formed near each of surfaces constituting a sidewall of the holding concave portion.

3. A heat treatment jig, comprising:

a substrate having a main surface including a holding concave portion formed in said main surface, said holding concave portion having sides and a bottom, said bottom being configured to hold an object;

a void part formed in said main surface adjacent to and outside an inner wall of the holding concave portion, the void part being a through-hole; and

a plurality of the holding concave portions,

wherein the void part is formed near sidewalls of the holding concave portions not adjacent to one another.

4. The heat treatment jig according to claim 3 , further comprising:

a plurality of the holding concave portions in array; and

a common void part formed near sidewalls of the holding concave portions and shared by the plurality of adjacent holding concave portions.

5. The heat treatment jig according to claim 3 , further comprising:

a plurality of the holding concave portions,

wherein the void part is formed near sidewalls of the holding concave portions not adjacent to one another,

wherein the void part is formed near each of surfaces constituting a sidewall of the holding concave portion, and

wherein the void part is formed to be a slit-like shape in a position almost parallel to the sidewall of the holding concave portion.

6. The heat treatment jig according to claim 5 , further comprising:

a plurality of the holding concave portions in array; and

a common void part formed near sidewalls of the holding concave portions and shared by the plurality of adjacent holding concave portions.

7. A heat treatment jig, comprising:

a substrate having a main surface including a holding concave portion formed in said main surface, said holding concave portion having sides and a bottom, said bottom being configured to hold an object;

a supporting bump portion formed to support the object to the bottom portion of the holding concave portion; and

a void part formed in said main surface adjacent to and outside an inner wall of the holding concave portion,

wherein the void part is a through-hole.

8. A heat treatment jig set, comprising:

a heat treatment jig including a substrate having a main surface including a holding concave portion formed in said main surface, said holding concave portion having sides and a bottom, said bottom being configured to hold an object, and

a void part formed in said main surface adjacent to and outside an inner wall of the holding concave portion, the void part being formed through the substrate; and

a detachable jig cover mounted to said main surface of the heat treatment jig to hold at least a part of the object held by the holding concave portion.

9. The heat treatment set according to claim 8 , wherein for the jig cover, an aperture is formed to at least a part of the area corresponding to the void part of the heat treatment jig.

10. The heat treatment set according to claim 9 , wherein the jig cover, an aperture is formed to at least a part of an area corresponding to the holding concave portion of the heat treatment jig.

11. The heat treatment set according to claim 8 , wherein for the jig cover, an aperture is formed to at least a part of an area corresponding to the holding concave portion of the heat treatment jig.

Assignments (2)
CHANGE OF NAME Recorded Nov 2, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025235/0456 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 5, 2007
From: EJIMA, DAISUKE; KIDA, TSUYOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019581/0372 →
Priority Claims (1)
JP 2006-193520 · Jul 14, 2006 · national
Continuity (1)
Related Publication 20080012193A1 · Jan 17, 2008