Semiconductor device

1. A semiconductor device, comprising:

a plurality of field effect transistors (FETs) provided in a certain region defined by an element isolation region,

wherein gate electrodes of said plurality of field effect transistors are arranged along a circular path in a plan view,

wherein at least two field effect transistors selected from said plurality of field effect transistors have substantially a same geometry, and

wherein each of said gate electrodes has a geometry that is substantially equivalent to a partial annular circle, which is prepared by eliminating a second sector from a first sector in said plan view, said first sector having a center, which is equivalent to a center of said circle, and said second sector having a center, which is also equivalent to the center of said circle, and having a radius, which is shorter than a radius of said first sector.

2. The semiconductor device as set forth in claim 1 , wherein said plurality of field effect transistors include a first, a second, a third and a fourth field effect transistors, and

wherein said gate electrodes of said first, said second, said third, and said fourth field effect transistors are arranged sequentially along said circle.

3. The semiconductor device as set forth in claim 2 , wherein a source region, a gate electrode, and a drain region of said third field effect transistor are electrically coupled to a source region, a gate electrode, and a drain region of said first field effect transistor, respectively, and

wherein a source region, a gate electrode, and a drain region of said fourth field effect transistor are electrically coupled to a source region, a gate electrode, and a drain region of said second field effect transistor, respectively.

4. The semiconductor device as set forth in claim 1 , further comprising a first diffusion layer and a second diffusion layer, each being provided in an outside and an inside of said circle in said plan view, respectively,

wherein one of said first and said second diffusion layers functions as a source region of said field effect transistor, and the other of said first and said second diffusion layers functions as a drain region of said field effect transistor.

5. The semiconductor device as set forth in claim 4 , wherein an end portion of said gate electrode protrudes toward the outside of said circle, and

wherein an end of said first diffusion layer is defined by the protruded section.

6. The semiconductor device as set forth in claim 5 , wherein an end portion of said gate electrode protrudes toward the inside of said circle, and

wherein an end of a portion of said second diffusion layer adjacent said gate electrode is defined by the protruded section.

7. The semiconductor device as set forth in claim 5 , wherein said plurality of field effect transistors share said second diffusion layer.

8. The semiconductor device as set forth in claim 7 , wherein said second diffusion layer functions as a source region of each of said field effect transistors.

9. The semiconductor device as set forth in claim 1 , wherein said plurality of field effect transistors include a pair of field effect transistors, each of which has a source region, said source regions of said pair of field effect transistors being mutually electrically coupled.

10. The semiconductor device as set forth in claim 5 , wherein said plurality of field effect transistors include a pair of field effect transistors, each of which has a source region, said source regions of said pair of field effect transistors being mutually electrically coupled.

11. The semiconductor device as set forth in claim 10 , wherein said pair of field effect transistors comprise components of one of a differential circuit and a mirror circuit.

12. The semiconductor device as set forth in claim 10 , wherein said pair of field effect transistors comprise one of a differential circuit and a mirror circuit in one of an operational amplifier and in a comparator.

13. A semiconductor device, comprising:

a first field effect transistor pair comprising a first field effect transistor and a second field effect transistor; and

a second field effect transistor pair comprising a third field effect transistor and a fourth field effect transistor,

wherein a gate electrode, a source region, and a drain region for each of the first and second field effect transistors are electrically connected,

wherein a gate electrode, a source region, and a drain region for each of the third and fourth field effect transistors are electrically connected, and

wherein the gate electrodes for each of the first, second, third, and fourth transistors are arranged along a circular path along an outer circumference of a central diffusion layer,

wherein each gate electrode for each of the first, second, third, and fourth transistors have substantially similar geometry, said geometry comprising an annulus having an arc length of less than 90 degrees, said annulus having an outer diameter defined by a respective first diffusion layer and an inner diameter defined by a second diffusion layer.

14. The semiconductor device of claim 13 , wherein the second diffusion layer functions as a source for each of the first, second, third, and fourth transistors.

15. The semiconductor device of claim 13 , wherein the second diffusion layer functions contacts each of the first, second, third, and fourth transistors.

16. The semiconductor device of claim 13 , wherein the first, second, third, and fourth transistors function as drain regions for the respective one of the first, second, third, and fourth transistors.

17. The semiconductor device of claim 16 , wherein an active region comprising the first, second, third, and fourth transistors is surrounded by an element isolation region.

18. The semiconductor device of claim 13 , further comprising a plurality of element isolation regions provided between each annular gate electrode.

19. The semiconductor device of claim 1 , wherein an annular shape of each gate electrode comprises an arc length of less than 90 degrees.