Patent Assignment
Reel/Frame 019591/0721
Assignment of Assignor's Interest
Recorded: 2007-07-02
Pages: 3
Assignee
RICOH COMPANY, LTD.
3-6, NAKAMAGOME 1-CHOME, OHTA-KU, TOKYO, 143-8555, JAPAN
Covered Property
(1)
Semiconductor Wafer Including Semiconductor Chips Divided by Scribe Line and Process-Monitor Electrode Pads Formed on Scribe Line
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.