Patent Assignment
Reel/Frame 019598/0120
Assignment of Assignor's Interest
Recorded: 2007-07-16
Pages: 2
Assignees
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
CANON'S COURT 22 VICTORIA STREET, HAMILTON HM 12, BERMUDA
Covered Property
(1)
Stacked Chip Package Structure with Leadframe Having Inner Leads with Transfer Pad