Assignment of Assignor's Interest

Recorded: 2007-07-23 Pages: 3

Assignors

SOGAWA, YOSHIMICHI

Executed: 2007-07-03

YAMAZAKI, TAKAO

Executed: 2007-07-03

TAKAHASHI, NOBUAKI

Executed: 2007-07-03

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus

Application: 11/720,066 →

Publication: US 2008/0001288

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.