Patent Assignment
Reel/Frame 019610/0588
Assignment of Assignor's Interest
Recorded: 2007-07-26
Pages: 5
Assignors
WU, YEN-YI
Executed: 2007-07-17
SUNG, WEI-YUEH
Executed: 2007-07-19
CHANG CHIEN, PAO-HUEI
Executed: 2007-07-23
CHU, CHI-CHIH
Executed: 2007-07-17
LEE, CHENG-YIN
Executed: 2007-07-18
WENG, GWO-LIANG
Executed: 2007-07-17
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAO-HSIUNG CITY, TAIWAN
Covered Property
(1)
Method of Making a Semiconductor Package and Method of Making a Semiconductor Device