Patent Assignment
Reel/Frame 019619/0996
Assignment of Assignor's Interest
Recorded: 2007-07-30
Pages: 3
Assignor
PARK, YUN MOOK
Executed: 2007-07-16
Assignee
NEPES CORPORATION
654-2, GAK-RI, OCHANG-MYUN, CHEONGWON-GUN, CHUNGBUK, 363-883, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Level System in Package and Fabrication Method Thereof