Patent Assignment
Reel/Frame 019630/0480
Assignment of Assignor's Interest
Recorded: 2007-08-01
Pages: 2
Assignors
BRUNNBAUER, MARKUS
Executed: 2007-06-22
POHL, JENS
Executed: 2007-06-25
STEINER, RAINER
Executed: 2007-06-25
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Device Including Covering a Semiconductor with a Molding Compound and Forming a Through Hole in the Molding Compound