Assignment of Assignor's Interest

Recorded: 2007-07-16 Pages: 2

Assignor

ABE, KAZUHIDE

Executed: 2007-06-26

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN

Covered Property (1)

Semiconductor device with improved adhesion between glue film and metal body

Application: 11/826,472 →

Publication: US 2008/0042281

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.