Patent Assignment
Reel/Frame 019639/0204
Assignment of Assignor's Interest
Recorded: 2007-08-02
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
3-6, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-8481, JAPAN
Covered Property
(1)
Heat-Transfer Structure and Substrate Processing Apparatus