Patent Assignment
Reel/Frame 019641/0079
Assignment of Assignor's Interest
Recorded: 2007-08-02
Pages: 3
Assignors
LEE, SE YOUNG
Executed: 2007-06-25
YOON, IL YOUNG
Executed: 2007-06-25
LEE, BOUNG JU
Executed: 2007-06-25
Assignee
SAMSUNG ELECTRONICS CO., LTD
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Embedded Semiconductor Device Including Planarization Resistance Patterns and Method of Manufacturing the Same