Patent Assignment
Reel/Frame 019653/0692
Assignment of Assignor's Interest
Recorded: 2007-08-06
Pages: 5
Assignors
YAMANO, TAKAHARU
Executed: 2007-07-09
IIZUKA, HAJIME
Executed: 2007-07-09
SAKAGUCHI, HIDEAKI
Executed: 2007-07-09
KOBAYASHI, TOSHIO
Executed: 2007-07-09
ARAI, TADASHI
Executed: 2007-07-09
KOBAYASHI, TSUYOSHI
Executed: 2007-07-09
KOYAMA, TETSUYA
Executed: 2007-07-09
IIDA, KIYOAKI
Executed: 2007-07-09
MASHIMA, TOMOAKI
Executed: 2007-07-09
TANAKA, KOICHI
Executed: 2007-07-09
KUNIMOTO, YUJI
Executed: 2007-07-09
YANAGISAWA, TAKASHI
Executed: 2007-07-09
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADAMACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Chip Embedded Substrate and Method of Producing the Same