Patent Assignment
Reel/Frame 019659/0186
Assignment of Assignor's Interest
Recorded: 2007-08-07
Pages: 3
Assignor
OBARA, TAICHI
Executed: 2007-06-29
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof