Patent Assignment
Reel/Frame 019664/0339
Assignment of Assignor's Interest
Recorded: 2007-07-24
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Laser Diode Having Wafer-Bonded Structure and Method of Fabricating the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.