IP Library › Assignment 019666/0189
Patent Assignment
Reel/Frame 019666/0189

Assignment of Assignor's Interest

Recorded: 2007-08-08 Pages: 4
Assignors
NAKAMURA, MIHO
Executed: 2007-07-25
FUKUDA, YOSHIYUKI
Executed: 2007-07-25
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
TOSHIBA MATERIALS CO., LTD.
8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI, KANAGAWA, 235-8522, JAPAN
Covered Property (1)
Ceramic Wiring Board and Process for Producing the Same, and Semiconductor Device Using the Same
Patent: 7,795,732 →
Application: 11/815,722 →
Publication: US 2009/0050920
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MATERIALS CO. LTD.
Reel/Frame 074940/0511 →
Change of Name Feb 19, 2026
From: TOSHIBA MATERIALS CO. LTD.
To: NITERRA MATERIALS CO., LTD.
Reel/Frame 074941/0803 →
Change of Address Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 074941/0846 →