Patent Assignment
Reel/Frame 019671/0369
Assignment of Assignor's Interest
Recorded: 2007-08-09
Pages: 4
Assignors
BAUER, MICHAEL
Executed: 2007-07-09
HAIMERL, ALFRED
Executed: 2007-07-09
MAHLER, JOACHIM
Executed: 2007-07-09
SCHOBER, WOLFGANG
Executed: 2007-07-09
KESSLER, ANGELA
Executed: 2007-07-09
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Electronic Module with a Semiconductor Chip and a Component Housing and Methods for Producing the Same