Patent Assignment
Reel/Frame 019672/0536
Assignment of Assignor's Interest
Recorded: 2007-08-09
Pages: 6
Assignors
KNICKERBOCKER, SARAH H.
Executed: 2007-07-10
ALLEN, SEAN A.
Executed: 2007-07-09
GARANT, JOHN J.
Executed: 2007-07-10
GORRELL, JERRY A.
Executed: 2007-07-09
PALMATIER, PHILLIP W.
Executed: 2007-07-10
TESSLER, CHRISTOPHER L.
Executed: 2007-07-10
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Process for Making Interconnect Solder Pb-Free Bumps Free from Organo-Tin/Tin Deposits on the Wafer Surface
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.