Patent Assignment
Reel/Frame 019697/0867
Assignment of Assignor's Interest
Recorded: 2007-08-15
Pages: 2
Assignors
HIROI, TAKASHI
Executed: 2007-05-17
TANIMOTO, KENJI
Executed: 2007-05-17
SASAKI, YUKO
Executed: 2007-05-18
MAKINO, HIROSHI
Executed: 2007-05-17
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
1-24-14, NISHI SHINBASHI,, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Wafer Inspection Tool and Semiconductor Wafer Inspection Method