Patent Assignment
Reel/Frame 019707/0102
Assignment of Assignor's Interest
Recorded: 2007-08-02
Pages: 3
Assignors
CHEN, YU-REN
Executed: 2007-07-25
SHEN, GENG-SHIN
Executed: 2007-07-25
LIN, HUNG TSUN
Executed: 2007-07-25
Assignees
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
CANON'S COURT, 22 VICTORIA STREET, HAMILTON HM 12, BERMUDA
Covered Property
(1)
Stacked Chip Packaging with Heat Sink Structure