Patent Assignment
Reel/Frame 019716/0906
Assignment of Assignor's Interest
Recorded: 2007-08-20
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Electroless Copper Plating Solution, Method of Producing the Same and Electroless Copper Plating Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.