Electroless copper plating solution, method of producing the same and electroless copper plating method
View Patent ↗Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) thereof is about 11.5 to about 13.0, a method of producing the same, and an electroless copper plating method. According to the plating solution of the present invention, an electroless copper plating film having stable and improved adhesivity and low electrical resistance can be obtained. Further, display devices including a metal pattern formed with the electroless copper plating solution can improve the reliability and price competitiveness of products prepared therefrom.
1. An electroless copper plating solution, comprising:
a copper salt;
a complexing agent;
a reductant, wherein the reductant is selected from the group consisting of formaldehyde, paraformaldehyde, mixtures thereof, and mixtures thereof with glyoxylic acid; and
a pH adjuster,
wherein the plating solution comprises a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) of the plating solution is about 11.5 to about 13.0.
2. The electroless copper plating solution according to claim 1 , wherein the molar ratio of the complexing agent to the copper salt is about 1:3, and the molar ratio of reductant to the copper salt is about 1:4.
3. The electroless copper plating solution according to claim 1 , wherein the plating solution comprises:
the copper salt in an amount of about 0.01 to about 0.05 mol/ ;
the complexing agent in an amount of about 0.03 to about 0.15 mol/ ;
the reductant in an amount of about 0.04 to about 0.20 mol/ ;
the pH adjuster in an amount of about 0.1 to about 0.2 mol/ ; and
the 2,2-dipyridyl acid solution in an amount of about 0.1 to about 0.5 mmol/ .
4. The electroless copper plating solution according to claim 1 , wherein the copper salt is selected from the group consisting of copper sulfate, copper nitrate, copper (II) chloride, copper formate, and mixtures thereof.
5. The electroless copper plating solution according to claim 1 , wherein the complexing agent is selected from the group consisting of ethylenediamine tetraacetic acid, hydroxyethyl ethylene triacetic acid, cyclohexanediamine tetraacetic acid, diethylenetriamine pentaacetic acid, tetrakis(2-hydroxypropyl)ethylenediamine, and mixtures thereof.
6. The electroless copper plating solution according to claim 1 , wherein the pH adjuster is selected from the group consisting of alkali hydroxide, tetramethylammonium hydroxide, tetraethylammonium hydroxide, and mixtures thereof.
7. The electroless copper plating solution according to claim 1 , wherein the alkali hydroxide is lithium hydroxide, sodium hydroxide, or potassium hydroxide.
8. The electroless copper plating solution according to claim 1 , wherein the plating solution has a hydrogen ion concentration (pH) of about 12.3 to about 12.8.
9. The electroless copper plating solution according to claim 1 , further comprising an additive selected from the group consisting of 1,10-phenanthroline, 2,9-dimethyl-1,10-phenanthroline, polyalkylene glycol, and mixtures thereof.
10. A method of producing an electroless copper plating solution, comprising:
dissolving a copper salt, a complexing agent and a reductant in water to prepare a plating solution;
adjusting a hydrogen ion concentration (pH) of the plating solution in the range of about 11.5 to about 13.0 with a pH adjuster;
dissolving 2,2-dipyridyl in a mixed solution of water and an acid to prepare a dipyridyl acid solution; and
mixing the dipyridyl acid solution with the pH-adjusted plating solution.
11. The method of producing an electroless copper plating solution according to claim 10 , wherein, in the step of adjusting a pH, the hydrogen ion concentration (pH) of the plating solution is adjusted to be about 12.3 to about 12.8.
12. The method of producing an electroless copper plating solution according to claim 10 , wherein the copper salt is selected from the group consisting of copper sulfate, copper nitrate, copper (II) chloride, copper formate, and mixtures thereof.
13. The method of producing an electroless copper plating solution according to claim 10 , wherein the complexing agent is selected from the group consisting of ethylenediamine tetraacetic acid, hydroxyethyl ethylene triacetic acid, cyclohexanediamine tetraacetic acid, diethylenetriamine pentaacetic acid, tetrakis(2-hydroxypropyl)ethylenediamine, and mixtures thereof.
14. The method of producing an electroless copper plating solution according to claim 10 , wherein the reductant is selected from the group consisting of formaldehyde, paraformaldehyde, glyoxylic acid, and mixtures thereof.
15. The method of producing an electroless copper plating solution according to claim 10 , wherein the pH adjuster is selected from the group consisting of alkali hydroxides, tetramethylammonium hydroxide, tetraethylammonium hydroxide, and mixtures thereof.
16. The method of producing an electroless copper plating solution according to claim 10 , further comprising the step of adding an additive selected from the group consisting of 1,10-phenanthroline, 2,9-dimethyl-1,10-phenanthroline, polyalkylene glycol, and mixtures thereof into the plating solution.
17. The method of claim 10 , wherein dissolving the copper salt, the complexing agent and the reductant in water is done sequentially.
18. A copper plating film prepared by the method of claim 10 , wherein less than or equal to 10% of the surface area of the copper film exhibits blistering.
19. An electroless copper plating method, wherein the plating is performed with the electroless copper plating solution according to claim 1 .
20. A copper plating film prepared by the electroless copper plating method of claim 19 .
21. The method of producing an electroless copper plating solution according to claim 15 , wherein the alkali hydroxides are lithium hydroxide, sodium hydroxide and potassium hydroxide.