Patent Assignment
Reel/Frame 019742/0158
Assignment of Assignor's Interest
Recorded: 2007-08-10
Pages: 3
Assignee
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE CO. LTD.
3/F, BUILDING 6, 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK,, SHATIN, NEW TERRITORIES HONG KONG, CHINA
Covered Property
(1)
Method of super flat chemical mechanical polishing technology and semiconductor elements produced thereof