Patent Assignment
Reel/Frame 019747/0306
Assignment of Assignor's Interest
Recorded: 2007-08-27
Pages: 4
Assignor
BENZEL, HUBERT
Executed: 2007-06-06
Assignee
ROBERT BOSCH GMBH
POSTFACH 30 02 20, STUTTGART, D-70442, GERMANY
Covered Property
(1)
Method for Mounting Semiconductor Chips, and Corresponding Semiconductor Chip System