IP Library › Assignment 019777/0801
Patent Assignment
Reel/Frame 019777/0801

Assignment of Assignor's Interest

Recorded: 2007-09-04 Pages: 2
Assignors
KAIZU, TAKUYA
Executed: 2007-08-01
IMAI, HIROAKI
Executed: 2007-08-01
SAITO, MASAYUKI
Executed: 2007-08-01
Assignee
HITACHI PLANT TECHNOLOGIES, LTD.
5-2, HIGASHI-IKEBUKURO, 4-CHOUME, TOSHIMA-KU, TOKYO, JAPAN
Covered Property (1)
Substrate Assembling Apparatus and Substrate Assembling Method Using the Same
Patent: 7,850,815 →
Application: 11/748,525 →
Publication: US 2007/0289711
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Mar 4, 2014
From: HITACHI PLANT TECHNOLOGIES, LTD.
To: HITACHI, LTD.
Reel/Frame 032384/0877 →
Assignment of Assignor's Interest Apr 26, 2017
From: HITACHI, LTD.
To: AIMECHATEC, LTD.
Reel/Frame 042148/0727 →