Patent Assignment
Reel/Frame 042148/0727
Assignment of Assignor's Interest
Recorded: 2017-04-26
Pages: 3
Assignor
HITACHI, LTD.
Executed: 2017-03-14
Assignee
AIMECHATEC, LTD.
5-2, KOYODAI, RYUGASAKI-SHI, IBARAKI-PREF., 301-0852, JAPAN
Covered Properties
(4)
Substrate Holding Device Including Adhesive Face with Hexagons Defined by Convex Portions
Substrate Assembly Apparatus and Substrate Assembly Method
Substrate Assembling Apparatus and Substrate Assembling Method Using the Same
Method for Holding Substrate in Vacuum
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2004
From: MURAYAMA, TAKAO; HIRAI, AKIRA; YAWATA, SATOSHI
To: SHARP KABUSHIKI KAISHA; HITACHI INDUSTRIES CO., LTD.
Reel/Frame 016483/0891 →
Assignment of Assignor's Interest
Sep 3, 2004
From: YOKOYAMA, NAOTO; MORIMOTO, MITSUAKI; NAKAHARA, MAKOTO
To: SHARP KABUSHIKI KAISHA; HITACHI INDUSTRIES CO., LTD.
Reel/Frame 016483/0993 →
Assignment of Assignor's Interest
Aug 11, 2006
From: ITO, MASAAKI; NAKAYAMA, YUKINORI; YAMAMOTO, TATSUHARU; IMAI, HIROAKI
To: HITACHI PLANT TECHNOLOGIES, LTD.
Reel/Frame 018178/0344 →
Merger
Sep 27, 2006
From: HITACHI INDUSTRIES CO., LTD.
To: HITACHI PLANT TECHNOLOGIES, LTD.
Reel/Frame 018329/0641 →
Assignment of Assignor's Interest
Aug 21, 2007
From: SHARP KABUSHIKI KAISHA
To: HITACHI PLANT TECHNOLOGIES, LTD.
Reel/Frame 019723/0917 →
Assignment of Assignor's Interest
Sep 4, 2007
From: KAIZU, TAKUYA; IMAI, HIROAKI; SAITO, MASAYUKI
To: HITACHI PLANT TECHNOLOGIES, LTD.
Reel/Frame 019777/0801 →
Merger
Mar 4, 2014
From: HITACHI PLANT TECHNOLOGIES, LTD.
To: HITACHI, LTD.
Reel/Frame 032384/0877 →