Patent Assignment
Reel/Frame 019778/0596
Assignment of Assignor's Interest
Recorded: 2007-09-04
Pages: 3
Assignor
LEE, BYOUNG-SU
Executed: 2007-07-19
Assignee
SILICONFILE TECHNOLOGIES INC
9F, YEWON BLDG, 75-1, YANGJAE-DONG, SEOCHO-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Bonding Aluminum Electrodes of Two Semiconductor Substrates
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.