Patent Assignment
Reel/Frame 041023/0058
Assignment of Assignor's Interest
Recorded: 2017-01-20
Pages: 5
Assignor
SILICONFILE TECHNOLOGIES INC.
Executed: 2016-12-22
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(40)
Cmos Active Pixel and Method of Driving the Same
Optical Image Receiving Device Having Wide Dynamic Range
Method of Bonding Aluminum Electrodes of Two Semiconductor Substrates
Separation Type Unit Pixel Having 3D Structure for Image Sensor
Separation Type Unit Pixel of 3-Dimensional Image Sensor and Manufacturing Method Thereof
Voice Coil Module
Image Sensor Having Anti-Reflection Film for Reducing Crosstalk
Image Sensor Using Back-Illuminated Photodiode and Method of Manufacturing the Same
Pixel for Picking Up Image Signal and Method of Manufacturing the Pixel
4 Transistors 4 Shared Step & Repeat Unit Cell and 4 Transistors 4 Shared Image Sensor Including the Unit Cells
3 Transistors 4 Shared Step & Repeat Unit Cell and 3 Transistors 4 Shared Image Sensor Including the Unit Cells
Chip-Stacked Image Sensor Having Image Signal Sensing Cell, Where the Image Signal Sensing Cell Has Photodiodes and Charge Transmission Transistors Commonly Connected to Charge Transmission Pads
Phototransistor Having a Buried Collector
Method of Manufacturing Crystalline Semiconductor Thin Film
Separated Unit Pixel Preventing Sensitivity Reduction and the Driving Method Using the Unit Pixel
4T-4S Step & Repeat Unit Pixel and Image Sensor Including the Unit Pixel
Image Sensor Capable of Judging Proximity to Subject
Image Sensor Photodiode Arrangement
Image Sensor with a Spectrum Sensor
Unit Pixel of Image Sensor Having Three-Dimensional Structure and Method for Manufacturing the Same
Image Sensor Having Wave Guide and Method for Manufacturing the Same
Image Sensor for Measuring Illumination, Proximity and Color Temperature
Jpeg Decoder Capable of Scaling and Scaling Method Using the Same
Back Side Illumination Image Sensor Reduced in Size and Method for Manufacturing the Same
Method for Forming Pad in Wafer with Three-Dimensional Stacking Structure
Image Sensor Capable of Realizing Night-Photographing and Functions of Proximity Sensor and Illuminance Sensor
Separation Type Unit Pixel of 3-Dimensional Image Sensor and Manufacturing Method Thereof
Image Sensor Having Wave Guide and Method for Manufacturing the Same
Back Side Illumination Image Sensor Reduced in Size and Method for Manufacturing the Same
Method for Forming Pad in Wafer with Three-Dimensional Stacking Structure
Pixel Array Having Wide Dynamic Range and Good Color Reproduction and Resolution and Image Sensor Using the Pixel Array
Method for Electrically Connecting Wafers Using Butting Contact Structure and Semiconductor Device Fabricated Through the Same
Multi-Substrate Image Sensor Having a Dual Detection Function
Pixel Array Having Wide Dynamic Range and Good Color Reproduction and Resolution and Image Sensor Using the Pixel Array
Substrate Stacked Image Sensor Having a Dual Detection Function
Image Sensor with 3D Stack Structure
Stack Chip Package Image Sensor
Pixel Circuit for Global Shutter of Substrate Stacked Image Sensor
Cmos Image Sensor Including Infrared Pixels Having Improved Spectral Properties, and Method of Manufacturing Same
Method for Manufacturing Through-Hole Silicon Via
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 5, 2006
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 017442/0364 →
Assignment of Assignor's Interest
Apr 21, 2006
From: LEE, DO YOUNG; YOON, KWANG HO
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 017520/0884 →
Assignment of Assignor's Interest
Sep 4, 2007
From: LEE, BYOUNG-SU
To: SILICONFILE TECHNOLOGIES INC
Reel/Frame 019778/0596 →
Assignment of Assignor's Interest
Oct 8, 2007
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 019928/0230 →
Assignment of Assignor's Interest
Dec 18, 2007
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 020264/0118 →
Corrective Assignment to Correct the Assignee's Address Previously Recorded on Reel 019928 Frame 0230. Assignor(S) Hereby Confirms the Assignment.
Jan 18, 2008
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 020388/0243 →
Assignment of Assignor's Interest
Jun 26, 2008
From: LEE, BYOUNG SU
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 021155/0834 →
Assignment of Assignor's Interest
Jul 9, 2008
From: WON, JUN HO; OH, SE JUNG; RIM, JAE YOUNG; LEE, BYOUNG SU
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 021214/0213 →
Assignment of Assignor's Interest
Dec 18, 2008
From: LEE, BYOUNG SU; WON, JUN HO
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 022002/0818 →
Assignment of Assignor's Interest
Feb 16, 2009
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 022262/0458 →
Assignment of Assignor's Interest
Sep 1, 2009
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 023178/0538 →
Assignment of Assignor's Interest
Oct 13, 2009
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 023362/0418 →
Assignment of Assignor's Interest
Nov 9, 2009
From: LEE, BYOUNG SU
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 023487/0971 →
Assignment of Assignor's Interest
Nov 29, 2009
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 023575/0928 →
Assignment of Assignor's Interest
Jan 7, 2010
From: LEE, BYOUNG SU
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 023749/0190 →
Assignment of Assignor's Interest
Jan 25, 2010
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 023842/0695 →
Assignment of Assignor's Interest
Feb 1, 2010
From: LEE, BYOUNG SU; SEO, YOUNG HO
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 023879/0792 →
Assignment of Assignor's Interest
Mar 19, 2010
From: LEE, DO YOUNG
To: SILICONFILE TECHNOLOGIES INC.
Reel/Frame 024108/0767 →