Multi-substrate image sensor having a dual detection function
The present invention relates to an image sensor in which substrates are stacked, wherein a substrate-stacked image sensor according to the present invention is configured such that a first photodiode is formed on a first substrate, a second photodiode is formed on a second substrate, the two substrates are aligned with and bonded to each other to electrically couple the two photodiodes to each other, thereby forming a complete photodiode within one pixel.
1. A multi-substrate image sensor having a dual detection function, the sensor comprising:
a first photodiode and a first pad formed on a first substrate; and
a second photodiode and a second pad formed on a second substrate,
wherein the first pad and the second pad are in direct physical contact to electrically couple the first photodiode and the second photodiode.
2. The image sensor according to claim 1 , wherein the first substrate and the second substrate are made of silicon (Si), germanium (Ge), or gallium arsenic (GaAs).
3. The image sensor according to claim 1 , wherein, on the second substrate, the entire or a part of access transistors are formed.
4. The image sensor according to claim 1 , wherein a transfer transistor is selectively formed on only one of the first and second substrates.
5. The image sensor according to claim 1 , wherein a first transfer transistor of access transistors is formed on the first substrate, and a second transfer transistor thereof is formed on the second substrate.
6. The image sensor according to claim 1 , wherein the first photodiode and the second photodiode are integrated by the contact to produce one complete photodiode in one pixel.
7. The image sensor according to claim 1 , wherein the first photodiode and the second photodiode are different from each other in sizes of P-N junctions thereof.
8. The image sensor according to claim 1 , wherein at least one of the first and second photodiodes has a trench formed on a periphery thereof.
9. The image sensor according to claim 8 , wherein the trench is filled with impermeable material.
10. The image sensor according to claim 1 , wherein the first photodiode is a back illuminated structure (BSI) and the second photodiode is a front illuminated structure (FSI).