Patent Assignment
Reel/Frame 019787/0222
Assignment of Assignor's Interest
Recorded: 2007-08-21
Pages: 3
Assignors
SEO, HO-SEONG
Executed: 2007-08-09
CHO, SHI-YUN
Executed: 2007-08-09
LEE, YOUNG-MIN
Executed: 2007-08-09
KIM, SANG-HYUN
Executed: 2007-08-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Semiconductor System in Package Using the Same