Patent Assignment
Reel/Frame 019788/0467
Re-Record to Add Assignee Previously Recorded at R/F 017382/0407
Recorded: 2007-09-05
Pages: 6
Assignors
LEE, HI-KUK
Executed: 2005-12-07
YAKO, YUKO
Executed: 2005-12-07
KIM, KYU-YOUNG
Executed: 2005-12-07
Assignees
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
SUMITOMO CHEMICAL COMPANY, LIMITED
27-1, SHINAKAWA 2-CHOME, CHUO-KU, TOKYO 104-8260, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Thin Film Panel Made with Photosensitive Composition, and Method for Manufacturing Thin Film Panel
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.