Patent Assignment
Reel/Frame 019835/0254
Assignment of Assignor's Interest
Recorded: 2007-09-17
Pages: 4
Assignors
NAKAMURA, SHINYA
Executed: 2007-08-09
MASUDA, TOMOYA
Executed: 2007-08-09
KATAYOSE, MITSUO
Executed: 2007-08-09
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Novel Curable Resin, Production Method Thereof, Epoxy Resin Composition, and Electronic Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →