Patent Assignment
Reel/Frame 019843/0536
Change of Name
Recorded: 2007-09-19
Received: 2007-09-19
Pages: 4
Assignor
LAMINA CERAMICS, INC.
Executed: 2006-06-14
Assignee
LAMINA LIGHTING, INC.
120 HANCOCK LANE, WESTAMPTON, NJ, 08060, UNITED STATES
Covered Properties
(26)
Optical Devices for Controlled Color Mixing
Application:
11/737,101 →
Thermally-Managed Led-Based Recessed Down Lights
Application:
11/621,131 →
Illumination Device for Providing Directionally Guided Light
Application:
11/602,148 →
Light emitting diode package and method for making same
Application:
11/475,292 →
Display Backlight with Improved Light Coupling and Mixing
Application:
11/474,187 →
Multicolor LED assembly with improved color mixing
Application:
11/445,611 →
Light Emitting Diodes with Improved Light Collimation
Application:
11/409,847 →
Low Temperature Co-Fired Ceramic-Metal Circulators and Isolators
Application:
11/364,272 →
Method of Making Optical Light Engines with Elevated Leds and Resulting Product
Application:
11/343,986 →
Surface Mountable Light Emitting Diode Assemblies Packaged for High Temperature Operation
Application:
11/179,863 →
High Performance Embedded Rf Filters
Application:
11/135,764 →
Light Emitting Diodes Packaged for High Temperature Operation
Application:
11/083,862 →
Led Light Sources for Image Projection Systems
Application:
11/030,648 →
Light Emitting Diodes Packaged for High Temperature Operation
Application:
10/933,096 →
Led Array Package with Internal Feedback and Control
Application:
10/894,185 →
Illumination Devices Comprising White Light Emitting Diodes and Diode Arrays and Method and Apparatus for Making Them
Application:
10/822,236 →
Light Emitting Diode Package Assembly That Emulates the Light Pattern Produced by an Incandescent Filament Bulb
Application:
10/788,116 →
Method and Structures for Enhanced Temperature Control of High Power Components on Multilayer Ltcc and Ltcc-M Boards
Application:
10/702,957 →
Light Emitting Diodes Packaged for High Temperature Operation
Application:
10/638,579 →
Method of Making Ceramic Multilayer Circuit Boards Mounted in a Patterned Metal Support Substrate
Application:
10/284,544 →
Low Temperature Co-Fired Ceramic-Metal Packaging Technology
Application:
10/199,418 →
Tunable Broadside Coupled Transmission Lines for Electromagnetic Waves
Application:
10/164,671 →
Temperature Compensating Device with Integral Sheet Thermistors
Application:
10/043,582 →
Temperatue Compensating Device with Embedded Columnar Thermistors
Application:
10/043,733 →
Monolithic Disc Delay Line
Application:
10/041,267 →
Ceramic Multilayer Circuit Boards Mounted on a Patterned Metal Support Substrate
Application:
09/852,901 →