Multicolor LED assembly with improved color mixing
In accordance with the invention, a multicolor LED assembly with improved color mixing comprises an assembly of closely-packed LED dice of different colors packaged for high temperature operation and arranged to minimize same-color adjacency to promote color mixing. The assembly of dice is encapsulated in a dispersive medium such as a transparent medium with entrained dispersive particles. The packaged assembly preferably includes a layer having light dispersing particles deposited directly on the LED.
1 . An assembly of colored light emitting diodes packaged for improved color mixing comprising:
a thermally conductive mounting base;
a plurality of LED dice mounted on the base, the plurality comprising one or more dies that emit light of a first color and one or more dies that emit light of a second color; and
a transparent material overlying the LED dice, said material including light dispersing particles to randomly mix light emitted by the plurality of LED dies.
2 . The assembly of claim 1 wherein the transparent material comprises an encapsulant material.
3 . The assembly of claim 1 wherein the transparent material is in the shape of a dome.
4 . The assembly of claim 1 wherein the plurality of LED dice are mounted in a closely packed configuration.
5 . The assembly of claim 4 wherein the closely packed configuration of LED dice comprises die to die gaps in the range between about 25 and about 2,000 microns.
6 . The assembly of claim 4 wherein the closely packed configuration of LED dice comprises die to die gaps in the range between about 125 and about 500 microns.
7 . The assembly of claim 1 wherein the plurality of LED dice comprise one or more red light emitting die, one or more green light emitting die and one or more blue light emitting die.
8 . The assembly of claim 1 wherein the plurality of LED dice are arranged to minimize same color adjacency.
9 . The assembly of claim 8 wherein the incidence of same color adjacency is approximately 60% or less.
10 . The assembly of claim 5 wherein the plurality of LED dice are arranged to have an incidence of same color adjacency of approximately 60% or less.
11 . The assembly of claim 1 further comprising an apertured printed wire board overlying the thermally conductive mounting base, wherein one or more apertures are in registration with the plurality of LED dice.
12 . The assembly of claim 1 wherein the thermally conductive mounting base comprises a metal layer, a ceramic layer disposed on the metal layer, and a surface cavity comprising an opening in the ceramic layer.
13 . The assembly of claim 1 wherein the light dispersing particles comprise particles of material selected from the group consisting of fumed silica, silicon, titanium oxide, indium oxide, tin oxide and combinations thereof.
14 . The assembly of claim 1 wherein the light dispersing particles comprise particles that are spherical, pyramidal or flat in shape, or combinations thereof.
15 . The assembly of claim 1 wherein the light dispersing particles comprise particles having average diameters in the range 0.01 to 100 microns.
16 . The assembly of claim 1 wherein the light dispersing particles deflect light at an angle in the range from about 2° to about 25°.
17 . The assembly of claim 1 wherein the light dispersing particles deflect light by reflection or refraction.
18 . The assembly of claim 1 wherein the light dispersing particles are dispersed throughout the transparent material.
19 . The assembly of claim 1 wherein the light dispersing particles are dispersed around the outer boundary of the transparent material.
20 . The assembly of claim 1 further comprising an interposer disposed between the base and at least one of the LED die, said interposer comprising a material having a thermal coefficient of expansion approximately equivalent to a coefficient of thermal expansion of the LED die.
21 . The assembly of claim 20 wherein the interposer is attached to the base with conductive epoxy, solder, brazing or mechanical means.
22 . The assembly of claim 20 wherein the interposer comprises material selected from the group consisting of copper, copper—molybdenum—copper, tungsten—copper, aluminum-silicon-carbide, aluminum nitride, silicon, beryllium oxide, and diamond.
23 . An assembly of colored light emitting diodes packaged for improved color mixing comprising:
a ceramic-coated metal base including an opening in the ceramic forming a surface cavity; and
a plurality of LED dice mounted within the cavity in thermal contact with the metal base, the plurality comprising one or more dies that emit light of a first color and one or more dies that emit light of a second color, said die mounted in closely packed relation with an incidence of same color adjacency of approximately 60% or less 23.
24 . The assembly of claim 23 wherein the LED dies are arranged with die to die gaps in the range between about 25 microns and about 2,000 microns.
25 . The assembly of claim 23 wherein the LED dies are arranged with die to die gaps in the range between about 125 microns and about 500 microns.
26 . The assembly of claim 23 further comprising a transparent material including light dispersing particles to randomly mix light from different LED dies.
27 . An assembly of colored light emitting diodes packages for improved color mixing comprising:
a low temperature co-fired ceramic-on-metal (LTCC-M) base, said base including a surface cavity;
a plurality of LED dice mounted within the cavity, the plurality comprising one or more dies that emit light of a first color and one or more dies that emit light of a second color; and
a transparent material overlying the plurality of LED dice, said material including light dispersing particles to randomly mix light emitted by the plurality of LED dies.
28 . The assembly of claim 27 wherein each of said LED die has a pair of electrodes overlying and electrically insulated from the metal base.
29 . The assembly of claim 28 further comprising conductive vias insulated from the base wherein the electrodes are electrically connected to the vias.
30 . The assembly of claim 27 further includes wire bonds to electrically connect the electrodes to the base.
31 . The assembly of claim 27 further comprising thermal connective pads mounted to the base to dissipate heat from the LED die.
32 . An assembly of colored light emitting diodes packaged for improved color mixing comprising:
a thermally conductive mounting base;
a plurality of LED dice mounted on the base, the plurality comprising one or more dies that emit light of a first color and one or more dies that emit light of a second color; and
a layer comprising light dispersing particles deposited on the plurality of LED dice.
33 . The assembly of claim 32 where in the layer comprises a monolayer.
34 . The assembly of claim 32 further comprising a transparent material overlying the LED die and the layer.
35 . The assembly of claim 32 wherein layer of light dispersing particle is adhered to the LED.
36 . The assembly of claim 32 wherein the layer includes a tacky transparent material.
37 . The assembly of claim 36 wherein the tacky transparent material is a resin having an index of refraction between the indices of refraction of the LED and the particles.
38 . The assembly of claim 37 wherein the index of refraction of the resin is in a range between about 1.77 and about 3.0.
39 . The assembly of claim 37 wherein the tacky transparent material is a silicone.
40 . The assembly of claim 32 wherein the light dispersing particles comprise a frequency converting phosphor.
41 . The assembly of claim 32 wherein the light dispersing particles comprise particles of material selected from the group consisting of fumed silica, silicon, titanium oxide, indium oxide, tin oxide and combinations thereof.
42 . The assembly of claim 32 wherein the plurality of LED dice are arranged to minimize the same color adjacency.
43 . The assembly of claim 42 wherein the plurality of LED dice are mounted in a closely packed configuration.
44 . The assembly of claim 43 wherein the closely packed configuration of LED dice comprises die to die gaps in the range between about 25 and about 2,000 microns.
45 . The assembly of claim 44 wherein the plurality of LED dice are arranged to have an incidence of same color adjacency of approximately 60% or less.