Patent Assignment
Reel/Frame 019852/0813
Assignment of Assignor's Interest
Recorded: 2007-09-06
Pages: 2
Assignor
WANG, LOW PENG
Executed: 2007-08-30
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Package Structure for Multiple Die Stack