IP Library › Assignment 019856/0882
Patent Assignment
Reel/Frame 019856/0882

Assignment of Assignor's Interest

Recorded: 2007-09-21 Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2007-09-13
LEE, JIN-YUAN
Executed: 2007-09-12
Assignee
MEGICA CORPORATION
ROOM 301/ 302, NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Post Passivation Interconnection Schemes on Top of the Ic Chips
Patent: 7,443,034 →
Application: 11/858,905 →
Publication: US 2008/0042296
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →