IP Library Assignment 019878/0762
Patent Assignment
Reel/Frame 019878/0762

Assignment of Assignor's Interest

Recorded: 2007-09-26 Pages: 7
Assignors
SWAIN, PRADYUMNA KUMAR
Executed: 2007-08-29
LEVINE, PETER
Executed: 2007-09-24
BHASKARAN, MAHALINGAM
Executed: 2007-08-01
GOLDSMITH, NORMAN
Executed: 2007-08-07
Assignee
SARNOFF CORPORATION
201 WASHINGTON ROAD, PRINCETON, NEW JERSEY, 08540
Covered Properties (2)
Method of Fabricating Back-Illuminated Imaging Sensors Using a Bump Bonding Technique
Patent: 7,541,256 →
Application: 11/779,414 →
Publication: US 2008/0237762
Method for Fabricating Thinned Back Illuminated Imagers Using a Bump Bonding Technique
Application: 60/908,436 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger May 30, 2012
From: SARNOFF CORPORATION
To: SRI INTERNATIONAL
Reel/Frame 028285/0060 →