IP Library › Assignment 019882/0611
Patent Assignment
Reel/Frame 019882/0611

Assignment of Assignor's Interest

Recorded: 2007-09-21 Pages: 2
Assignors
UNO, TOMOHIRO
Executed: 2007-07-13
YAMAMOTO, YUKIHIRO
Executed: 2007-07-13
Assignee
NIPPON STEEL MATERIALS CO., LTD.
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8071, JAPAN
Covered Property (1)
Bonding Wire for Semiconductor Device
Patent: 7,820,913 →
Application: 11/794,797 →
Publication: US 2009/0188696
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 17, 2020
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 052183/0361 →
Merger and Change of Name Mar 17, 2020
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 052183/0480 →