IP Library › Assignment 019884/0159
Patent Assignment
Reel/Frame 019884/0159

Assignment of Assignor's Interest

Recorded: 2007-09-25 Pages: 2
Assignors
KIMURA, KEIICHI
Executed: 2007-07-25
UNO, TOMOHIRO
Executed: 2007-07-25
Assignee
NIPPON STEEL MATERIALS CO., LTD.
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8071, JAPAN
Covered Property (1)
Gold Wire for Connecting Semiconductor Chip
Patent: 7,830,008 →
Application: 11/795,921 →
Publication: US 2008/0105975
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 17, 2020
From: NIPPON STEEL MATERIALS CO., LTD.
To: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
Reel/Frame 052183/0361 →
Merger and Change of Name Mar 17, 2020
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 052183/0480 →