IP Library › Assignment 019884/0862
Patent Assignment
Reel/Frame 019884/0862

Assignment of Assignor's Interest

Recorded: 2007-09-18 Pages: 3
Assignors
CHOI, RAK HUN
Executed: 2007-08-14
KURESHOV, VLADIMIR
Executed: 2007-08-14
OH, BANG WON
Executed: 2007-08-18
PARK, GIL HAN
Executed: 2007-08-14
PARK, HEE SEOK
Executed: 2007-08-14
PARK, SEONG EUN
Executed: 2007-08-14
PARK, YOUNG MIN
Executed: 2007-08-14
KIM, MIN HO
Executed: 2007-08-14
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN3-CHOME, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Method of manufacturing III group nitride semiconductor thin film and method of manufacturing III group nitride semiconductor device using the same
Application: 11/898,955 →
Publication: US 2008/0099781
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →