IP Library › Assignment 019888/0649
Patent Assignment
Reel/Frame 019888/0649

Assignment of Assignor's Interest

Recorded: 2007-09-27 Pages: 4
Assignors
MEYER, THORSTEN
Executed: 2007-08-27
HEDLER, HARRY
Executed: 2007-08-31
BRUNNBAUER, MARKUS
Executed: 2007-08-27
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Method for Producing Chip Packages, and Chip Package Produced in This Way
Patent: 8,012,807 →
Application: 11/776,976 →
Publication: US 2008/0012144
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 18, 2012
From: INFINEON TECHNOLOGIES AG
To: INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
Reel/Frame 027548/0623 →
Assignment of Assignor's Interest Jan 19, 2012
From: INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
To: INTEL MOBILE COMMUNICATIONS GMBH
Reel/Frame 027556/0709 →
Change of Name Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest Aug 29, 2022
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 061356/0001 →