Assignment of Assignor's Interest

Recorded: 2007-09-12 Pages: 2

Assignor

TAKAHASHI, NORIO

Executed: 2006-02-27

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO 105-8460, JAPAN

Covered Property (1)

Semiconductor chip package and method manufacturing method thereof

Application: 11/898,449 →

Publication: US 2008/0012148

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.