Patent Assignment
Reel/Frame 019912/0518
Assignment of Assignor's Interest
Recorded: 2007-09-26
Pages: 7
Assignors
SOGAWA, YOSHIMICHI
Executed: 2007-06-18
YAMAZAKI, TAKAO
Executed: 2007-06-18
HAZEYAMA, ICHIROU
Executed: 2007-06-18
KITAJOU, SAKAE
Executed: 2007-06-18
TAKAHASHI, NOBUAKI
Executed: 2007-06-18
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KY, TOKYO, 108-8001, JAPAN
NEC ELECTRONICS CORPROATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Having a Buffer Layer in a Throughhole and Method of Manufacturing Same
Application:
11/722,702 →
Publication:
US 2008/0224271
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 27, 2007
From: SOGAWA, YOSHIMICHI; YAMAZAKI, TAKAO; HAZEYAMA, ICHIROU; KITAJOU, SAKAE
To: NEC CORPORATION; NEC ELECTRONICS CORPORATION
Reel/Frame 019487/0110 →
Change of Name
Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0860 →