Patent Assignment
Reel/Frame 019918/0837
Assignment of Assignor's Interest
Recorded: 2007-10-04
Pages: 3
Assignor
PARK, KYUNG MIN
Executed: 2007-09-27
Assignee
DONGBU HITEK CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property
(1)
Metal Wiring of Semiconductor Device and Forming Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.