Patent Assignment
Reel/Frame 019919/0125
Assignment of Assignor's Interest
Recorded: 2007-10-04
Pages: 4
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
PARC TECHNOLOGIQUE DES FONTAINES, F-38190 BERNIN, FRANCE
Covered Property
(1)
Method for Manufacturing Compound Material Wafer and Corresponding Compound Material Wafer
Application:
11/850,170 →
Publication:
US 2008/0268621
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.