Patent Assignment
Reel/Frame 019925/0285
Assignment of Assignor's Interest
Recorded: 2007-10-05
Pages: 3
Assignor
YANG, WEN-KUN
Executed: 2007-03-28
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY, INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU COUNTY, 303, TAIWAN
Covered Property
(1)
Semiconductor Device Package with Die Receiving Through-Hole and Dual Build-Up Layers Over Both Side-Surfaces for Wlp and Method of the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name
Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest
Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →