Patent Assignment
Reel/Frame 019927/0500
Assignment of Assignor's Interest
Recorded: 2007-10-05
Pages: 3
Assignee
PAC TECH - PACKAGING TECHNOLOGIES GMBH
AM SCHLANGENHORST 15-17, D-14641 NAUEN, GERMANY
Covered Property
(1)
Method and Device for Transferring a Chip to a Contact Substrate