Patent Assignment
Reel/Frame 019937/0074
Assignment of Assignor's Interest
Recorded: 2007-10-10
Pages: 9
Assignors
CHO, HOO SUNG
Executed: 2007-10-08
JUNG, SOON MOON
Executed: 2007-10-08
RAH, YOUNG SEOP
Executed: 2007-10-08
JANG, JAE HOON
Executed: 2007-10-08
JEONG, JAE HUN
Executed: 2007-10-08
PARK, JUN BEOM
Executed: 2007-10-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with Three-Dimensional Array Structure