IP Library › Assignment 019941/0870
Patent Assignment
Reel/Frame 019941/0870

Corrective Assignment to Correct the Execution Date of the Inventors to Read 08/31/2007 Previously Recorded on Reel 019918 Frame 0957. Assignor(S) Hereby Confirms the Corrective Assignment.

Recorded: 2007-10-10 Pages: 6
Assignors
NEYRET, ERIC
Executed: 2007-08-31
BOEDT, FRANCOIS
Executed: 2007-08-31
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
PARC TECHNOLOGIQUE DES FONTAINES, F-38190 BERNIN, FRANCE
Covered Property (1)
Process for Fabricating a Substrate of the Silicon-on-Insulator Type with Reduced Roughness and Uniform Thickness
Patent: 7,939,427 →
Application: 11/849,912 →
Publication: US 2009/0035920
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 4, 2007
From: NEYRET, ERIC; BOEDT, FRANCOIS
To: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
Reel/Frame 019918/0957 →