Patent Assignment
Reel/Frame 019957/0817
Assignment of Assignor's Interest
Recorded: 2007-10-12
Pages: 3
Assignors
LEE, HSIN-HUI
Executed: 2007-10-11
LII, MIRNG-JI
Executed: 2007-10-11
LEE, CHIEN-HSIUN
Executed: 2007-10-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Thermally Enhanced Wafer Level Package