Patent Assignment
Reel/Frame 019961/0056
Assignment of Assignor's Interest
Recorded: 2007-10-12
Pages: 4
Assignors
LIN, CHIAN-CHI
Executed: 2007-10-02
CHANG, CHIH-HUANG
Executed: 2007-10-02
LIN, YUEH-LUNG
Executed: 2007-10-02
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Chip Package Manufacturing Method and Structure Thereof